Electroforming

The metal mould inserts, metal foils and microparts are produced by electrochemical deposition of metal into the photo-resist structure. This galvanic process can use different electrolytes, depending on the requirements: nickel, hard nickel, nickel alloys and copper. The electroforming process of nickel and nickel alloys can be well controlled and the material has excellent mechanical characteristics. Copper is the preferred material in micro-electronics and semiconductor production, due to its excellent electrical conductivity. temicon uses state of the art electroforming equipment from technotrans, which are specifically designed for the requirements of micro and nano technology. The small format units can handle dimensions of up to 240 mm round or 150 mm square, the large format units up to 20 x 24 inches (508 x 609.6 mm). The adjustment of electrolyte recipe and process parameters helps to optimise material and product characteristics to a great extent.