Plasma cleaning, large and small formats Plasma cleaning, large and small formats Lapping machine, Peter Wolters GmbH Lapping machine, Peter Wolters GmbH Grinding, MST department, University Dortmund Grinding, MST department, University Dortmund

Finishing

After the electroforming process the product is cleaned (removal of the photo-resist) and mechanically treated with regard to the required geometry and surface quality. Chemical and electrochemical processes as well as plasma cleaning are employed to remove the photo-resist. All cleaning steps can be carried out for small and large formats of up to 20 x 24 inches (508 x 609.6 mm).

The back sides of the mould inserts are levelled off by lapping and even adjusted to the desired thickness, if required. The final outer dimensions of the mould inserts and metal foils are achieved by mechanical cutting or laser cutting. The microparts can be supplied on the carrier substrate or individually.