Spin coating, MST department, University Dortmund
Photo-resist, MST department, University Dortmund
Exposure in mask aligner, MST department, University Dortmund
Lithography
Lithography stands right at the beginning of the technological chain. Depending on the product requirements different lithography processes can be used: UV, laser, electron beam or X-ray lithography. temicon mainly relies on UV lithography for wafer formats and large formats and uses a lithography line in the clean-room. The kind of photo-resist as well as coating, exposure and development techniques are selected to suit the product, as required by the customer. Furthermore temicon can access other lithography methods within the technology network in Dortmund.
