Sputtering

The metallization of surfaces by sputtering (PVD process: Physical Vapour Deposition) is an important technological part of the production chain. Sputtering is also carried out in the clean-room. The large format sputtering unit of temicon is designed for wafer, multi-wafer and large formats of up to 20 x 24 inches, or 508 x 609.6 mm. The metal layers are deposited on the substrate with a precision in the lower nm-range and with the required properties such as layer thickness and adhesion. The main focus with regard to the material is on nickel-vanadium as a seed layer for the electroforming process and chromium as a versatile adhesive layer.