We use UV lithography as a key mastering process for microstructures down to 1 µm feature size.
Over several years temicon has consequently developed UV lithography and now has technological USPs in terms of e.g. large formats (square meter), gapless lens arrays, high aspect ratios (above 2,0), taper angles of 85° ± 2° which allow a precise demolding in following production steps. In this manner, a large variety of microstructures with customized functionalities can be realized.
In our Clean Room with a size of 400 m² a UV-lithography line is installed for wafer formats up to 200 mm including resist coating, exposure, wet processing and sputtering.