High precision Metal Parts

temicon is producing high precision metal microparts on industrial scale via lithography and electroforming. Whenever traditional methods such as metal cutting, embossing, laser
cutting or photo etching reach their limits, our innovative technologies come into play.

» See also: LiGa = Lithography and Electroforming

Application in high-tech industries

Typically, a large number of metal components are produced in one batch and separated afterwards, which enables a high quality and cost-efficient volume production. The
micro structures have dimensions of several 100 µm down to 100 nm.

Micro membranes and micro sieves are used in a variety of industries, for example, in environmental engineering, food, pharma, life science, optical, fluidic, mechanical or electronic systems.

The micro-hole structures are for example used for filtration, separation, metering and vaporization. The small parts are often keystone components of high-tech equipment and devices. Another important field of application are micro-perforated stencils and shadow masks for screen printing or PVD processes.


soft-nickel (~200–250HV 0,1)
hard-nickel (~600–650HV 0,1)

gold-plated (galvanic (2–3 µm)
sputtered (~0,1 µm)
blackened (chromium 2–3 µm)
black nickel (some nanometers)

outer dimensions:
soft-nickel (480 mm x 580 mm)
hard-nickel(370 mm x 470 mm)

5 µm – 320 µm

structure size:
0,3 µm – several millimeters

hole profile:
Cylindrical profile
2-step profilel
Trumpet profile